The Expertise and Capabilities Needed to Deliver from the Smallest Sub-Assembly to Complete Complex Systems

  • Build to Print Manufacturing
  • CFM, Full Turnkey
  • Low volume, High mix
  • In and Out of Warranty Depot Service
  • Turnkey and CFM Manufacturing
  • Cable & Wire Harness Assembly
  • SMT (Surface Mount Technology)
  • 3D SPI
  • 3D X-Ray
  • 3D AOI
  • Through Hole Assembly
  • Conformal Coat, Bonding, Staking, Underfill
  • Mechanical Assembly & Box Build
  • ESS (Environmental Stress Screening)
  • Test: Analog, Digital, RF
  • Conformal Coat

Custom Special Test Equipment (STE)

Tactical Systems (Box Build)

Ruggedized Devices

Circuit Card Assembly (CCA)

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